Priklady_vicevrstvych_DPS
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Application : OSP Test Board
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : Cellular Phone
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm
Application : Cellular Phone
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : Cellular Phone
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm
Application : Cellular Phone
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : Cellular Phone
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm
Application : Cellular Phone
Layer & Thick : 6Layers, 0.8mm
Min.Hole Size : 0.15mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : Infra Structure Board
Layer & Thick :16Layers, 1.6mm
Min.Hole Size : 0.15mm
Application : Infra Structure Board
Layer & Thick :16Layers, 1.6mm
Min.Hole Size : 0.15mm
C
H
H
D
I
F
`
D
E
IJ
1
1
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : Infra Structure Board
Layer & Thick :14Layers, 1.6mm
Min.Hole Size : 0.25mm
Application : Infra Structure Board
Layer & Thick :14Layers, 1.6mm
Min.Hole Size : 0.25mm
TECHNOLOGY & PRODUCT
Build-up Structure
Image
Application : Infra Structure Board
Layer & Thick :12Layers, 1.6mm
Min.Hole Size : 0.25mm
Application : Infra Structure Board
Layer & Thick :12Layers, 1.6mm
Min.Hole Size : 0.25mm
Artwork Design Rules
<Unit : um>
<Unit : um>
Artwork Design Rules
Low Cost High Cost
Artwork Design Rules
Low Cost High Cost
A Line Width
100
75
E PTH Drill size
300
250
B Line to Line Pitch
200
150
E' Buried via Drill size
250
200
C Outer Laser via size(Top)
F PTH Drill Land
550
450
D Outer Laser via Land
450
350
F' Buried via Drill Land
500
400
150
D
A
B
C
F
E
E’
F’