TDA2003
Níže je uveden pouze náhled materiálu. Kliknutím na tlačítko 'Stáhnout soubor' stáhnete kompletní formátovaný materiál ve formátu PDF.
0.878
0.886
0.894
L4
1.29
0.051
L5
2.6
3
0.102
0.118
L6
15.1
15.8
0.594
0.622
L7
6
6.6
0.236
0.260
L9
0.2
0.008
M
4.23
4.5
4.75
0.167
0.177
0.187
M1
3.75
4
4.25
0.148
0.157
0.167
V4
40
° (typ.)
L
L1
A
C
L5
D1
L2
L3
E
M1
M
D
H3
Dia.
L7
L6
F1
H2
F
G G1
E1
F
E
L9
V4
R
R
R
RESIN BETWEEN
LEADS
H1
V3
H2
L8
V
V
V1
B
V
V
V4
V4
OUTLINE AND
MECHANICAL DATA
9/10
TDA2003
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics
1998 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands -
Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
http://www.st.com
10/10
TDA2003