Package_outline_dimensions_and_layout
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4.82
A1
1.1
-
1.40
A2
2.05
-
2.92
b
0.72
-
1.00
b2
1.16
-
1.45
c
0.36
-
0.68
D
14.70
-
15.87
e1
5.08
E
9.80
-
10.26
H1
5.80
-
6.40
L
12.70
-
13.96
L1
3.56
-
4.50
P
3.70
-
3.90
Q
2.54
-
3.30
All Dimensions in mm
H1
L1
D
L
Q
L2
E
b2
b
A
A1
A2
c
e1
P
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
300 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220AC (13.7mm Min Lead Length)
TO220AC
(13.7mm Min Lead Length)
Dim
Min
Max
Typ
A
4.470
4.670
-
A1
2.520
2.820
-
b
0.710
0.910
0.813
b2
1.170
1.370
1.270
c
0.279
0.483
-
c2
1.170
1.370
-
D
10.010 10.310
-
E
8.763
9.017
8.890
E1
12.294 12.548
12.446
e
2.54BSC
e1
4.980
5.180
-
L
13.700 14.100
-
L1
4.04
4.19
4.11
L2
-
1.60
-
ØP
3.790
3.890
-
Q
2.642
2.946
2.743
All Dimensions in mm
L1
E1
L
Q
L2
D
b2
b
A
c2
A1
c
e1
P
O
1
.50
e
E
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.