Package_outline_dimensions_and_layout
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c
0.356 0.61
-
D 14.22 16.51
-
D1 8.39 9.01
-
D2 11.45 12.87
-
e
-
-
2.54
e1
-
-
5.08
E
9.66 10.66
-
E1 6.86 8.89
-
H1 5.85 6.85
-
L
12.70 14.73
-
L1
-
6.35
-
L2 15.80 16.20 16.00
P
3.54 4.08
-
Q
2.54 3.42
-
All Dimensions in mm
E
Q
D1
D
ØP
L1
L
e
b
A1
A
H1
c
A2
b2
H1
D2
E1
e1
E/2
L2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
297 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220AB(Type C)
TO220AB
(Type C)
Dim
Min
Max
Typ
A
-
-
4.500
A2
-
-
2.400
A3
-
-
1.300
b
0.700
0.900
-
b1
-
-
1.270
c
0.400
0.600
-
D
9.800
10.200
-
E
9.000
9.400
-
e
-
-
2.54
H1
6.300
6.700
-
L
12.600
13.600
-
L1
9.600
10.600
-
Y
-
-
11.100
Ø
3.560
3.640
-
All Dimensions in mm
3°
D
Y
E
L
L1
H1
3°
3°
A
A2
c
e
e
A3
1.30
1.70
0.60
ø
b
b1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.