Package_outline_dimensions_and_layout
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Rev. 90
301 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220AC (Type A4)
TO220AC
(Type A4)
Dim
Min
Max
Typ
A
4.470
4.670
-
A1
1.170
1.370
-
A2
2.520
2.820
-
b
0.710
0.910
0.813
b2
1.170
1.370
1.270
c
0.279
0.483
-
D1
8.763
9.017
8.890
E
10.010 10.310
-
e
2.54BSC
e1
4.980
5.180
-
H1a 12.294 12.548 12.446
L
13.700 14.100
-
L1
4.04
4.19
4.11
L2
-
1.60
-
Q
2.642
2.946
2.743
ØP
3.790
3.890
-
All Dimensions in mm
L1
H1a
L
Q
L2
E
b2
b
A
A1
A2
c
e1
P
O 1
.50
e
D1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
302 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO220AC (Type BR)
TO220AC
(Type BR)
Dim
Min
Max
Typ
A
4.30
4.70
4.50
A1
1.20
1.40
1.30
A2
2.20
2.60
2.40
b
0.70
0.90
0.80
b2
-
-
1.27
c
0.40
0.60
0.50
D1
9.00
9.40
9.20
E
9.80
10.20
10.00
e
4.88
5.28
5.08
H1
6.30
6.70
6.50
H1a
10.90