Package_outline_dimensions_and_layout
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Rev. 90
304 of 316
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Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO247
TO247
Dim
Min
Max
A
1.9
2.1
B
4.85
5.15
C
20.3
21.75
D
19.60
20.1
E
2.2
2.6
G
0.51
0.76
H
15.45
16.25
J
1.93
2.18
K
2.9
3.2
L
3.78
4.38
M
5.2
5.7
N
1.0
1.4
P
1.8
2.2
Q
2.8
3.2
S
4.4 Typ
All Dimensions in mm
A
B
E
G
J
L
M
N
P
Q
K
S
M
H
D
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.
Rev. 90
305 of 316
www.diodes.com
Package Outline Dimensions
Suggested Pad Layout
© Diodes Incorporated
Package Outline Dimensions
TO251
TO251
Dim
Min
Max
A
2.200
2.400
A2
0.890
1.150
A3
0.450
0.550
b
0.550
0.740
c
0.450
0.570
D
6.400
6.750
D2
5.200
5.400
E
5.950
6.250
E2
0.900
1.250
e
2.240
2.340
e1
4.430
4.730
L
8.900
9.500
All Dimensions in mm
45°
D
D2
E
L
E2
b
e
e1
A
A3
c
A2
Option 2
Option 3
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers
may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding
0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for
International grid details, please see document IEC, Publication 97.